https://www.bloomberg.com/news/articles/2026-07-25/samsung-inks-200-billion-chip-supply-with-broadcom 



[!quote]+ 
三星电子周六表示，与这家美国芯片设计师达成协议博通为了扩大内存芯片、合同芯片制造和先进封装领域的合作，预计至2030年规模将超过2000亿美元。 

https://www.reuters.com/business/autos-transportation/samsung-elec-wins-200-billion-broadcom-ai-chip-partnership-boosting-foundry-push-2026-07-25/